Total 15 products
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GBT-ViaTHERM TGR SERIES THERMAL GREASE
GBT-ViaTHERM TGR series is a high-performance thermal grease based on silicone resin. It has excellent wetting characteristics and can fill the irregular micro-structure on the component surface very well to form a very low thermal resistance interface. It has very good reliability, does not dry, precipitate or harden. Its coating thickness is usually between 0.05-0.15mm.
TGR is used to solve the problem of heat dissipation of general components. It is in the form of a viscous liquid, which ca -
GBT-ViaTHERM PCF SERIES PHASE CHANGE THERMALLY CONDUCTIVE FILM
GBT-ViaTHERM PCF series is a high-performance phase change thermally conductive material designed to meet the requirements of high-end thermal applications, such as high-efficiency processor, thermal module and heat sink. The PCF material provides extremely low thermal resistance between components and heat sinks. The material will undergo melts at 50-57°C and flows but does not overflow. It can squeeze out the air from the gap, thoroughly wet the contact surface, and form a very low thermal re -
GBT-ViaTHERM GRF SERIES THERMALLY CONDUCTIVE GRAPHITE FILM
GBT-ViaTHERM GRF is a synthetic graphite material with ultra-high thermal conductivity in planer direction. This material has a regular carbon hexagonal layered arrangement in the horizontal direction and thermal conductivity up to 1,500W/m-K. It can be one side adhesive for easy operation. -
GBT-ViaTHERM TPC SERIES POTTING COMPOUND
GBT-ViaTHERM TPC series potting compound is a two-component thermally conductive material with a 1:1 ratio (by weight) between the A and B components. Material can be cured at room or elevated temperatures. The cured material protects the packaged components from environmental impact such as vibration, humidity and salt spray. This highly fluid material can be filled into complex structures and provides functions that cannot be achieved with ordinary thermal pads. The material provides excellen -
GBT-ViaTHERM SFA SERIES THERMALLY CONDUCTIVE RF ABSORBER GEL
The ViaTHERM SFA series material provides excellent thermal performance, microwave absorption, low compressibility and high reliability. In addition to providing application flexibility and variable gap adaptation, the ViaTHERM™ SFA series also has excellent compressibility and conformability, making it easier to fully contact the mating parts to improve the heat transfer efficiency.
Unlike thermal grease, ViaTHERM™ SFA series gel has no settling and no flow over issue, suitable for dispensing, -
GBT-ViaTHERM NFG SERIES SILICONE FREE THERMALLY CONDUCTIVE GEL
GBT ViaTHERM NFG series is a non-silicon based low thermal resistance high performance dispensable thermal interface material specially developed for applications sensitive to Siloxane. The material itself has tackiness properties and at the same time has good wettability, so that the mating parts are fully contacted and the heat transfer efficiency is improved. No curing is required. Material can be easily reworked. This compliant material provides very low compressibility to meet the applicat -
GBT-ViaTHERM™ TFG SERIES TWO-COMPONENT THERMALLY CONDUCTIVE GEL
GBT-ViaTHERM TFG series, a soft two-component thermally conductive gel material, has excellent thermal conductivity. Material can be cured at room or elevated temperature. Before curing, the material retains good thixotropic properties and is easy to apply. Its physical appearance is that of a soft cure-in-place pad.
TFG series is ideal for thermal applications where low pressure components that need to be considered, such as sharing a common heating sink/enclosure with multiple heights heat gen -
GBT-ViaTHERM SFG SERIES ONE-COMPONENT CURABLE THERMALLY CONDUCTIVE GEL
GBT-ViaTHERM SFG series thermally conductive gels are specially designed for the heat dissipation requirements of high-performance devices requiring low thermal resistance, in order to achieve optimal heat dissipation performance to ensure the reliability of the device operation. The material is very soft and requires low compression forces, working on mounting surfaces of varying heights, as well as for ultra-thin thermally conductive interface. The stable polymer provides superior long-term s -
GBT-ViaTHERM SFG SERIES ONE-COMPONENT THERMALLY CONDUCTIVE GEL
GBT-ViaTHERM SFG series thermally conductive gels are specially designed for the heat dissipation requirements of high-performance devices requiring low thermal resistance, in order to achieve optimal heat dissipation performance to ensure the reliability of the device operation. The material is very soft and requires low compression forces, working on mounting surfaces of varying heights, as well as for ultra-thin thermally conductive interface. The stable polymer provides superior long-term s -
GBT-ViaTHERM EB SERIES THERMALLY CONDUCTIVE INSULATOR
GBT ViaTHERM EB is a type of electrical insulating and thermally conductive
Thermally conductive insulating material designed to resist overheating in today's electronic components breakdown voltage requirements. The product is based on glass fiber or PI film, which has strong puncture resistance to avoid puncture of screws or other components during use or installation. Thin Soft conformal coating on membrane provides excellent mating surface for installation and reduces interface heat resistan -
GBT-ViaTHERM NFP SERIES NON-SILICONE THERMAL PADS
GBT ViaTHERM NFP series material is high-performance, compressible, and silicone-free. Material is suitable for silicone-sensitive applications, featuring low volatile, no silicone oil penetration, and no contamination to PCB circuits.
NFP series materials has a soft texture, high compressibility, and excellent surface wetting characteristics, resulting in low thermal resistance between heat source components and heat sink or housing. This makes it ideal for applications where conventional ther -
GBT-ViaTHERM TFP SERIES 6~12W/m.K HIGH PERFORMANCE THERMAL PADS
GBT ViaTHERM TFP series 6 to 12W/m.K thermal pads have high performance. With special formulation, pads have excellent thermal performance and are easy to handle. The natural tackiness of the material makes it good contact to the application area, thereby reducing the thermal resistance.
For the special convenience of use and rework, a non-sticky "dry surface" can be formed on one side through a unique process. The thermal pads' non-tacky side can be easily removed from IC chips, PCB or other c -
ViaTHERM TFP SERIES 3.5~5.1W/m.K HIGH PERFORMANCE THERMAL PADS
GBT ViaTHERM TFP series 3.5 to 5.1W/m.K thermal pads have higher thermal conductivity. With special formulation, pads have excellent thermal performance and are easy to handle. The natural tackiness of the material makes it good contact to the application area, thereby reducing the thermal resistance.
For the special convenience of use and rework, a non-sticky "dry surface" can be formed on one side through a unique process. The thermal pads' non-tacky side can be easily removed from IC chips, -
ViaTHERM TFP Series 2.2 - 3.0W/m.K Thermal Pad
GBT ViaTHERM TFP series thermal pads are cost-effective. With special formulation, pads have low density while maintaining excellent thermal performance and being easy to handle. The natural tackiness of the material makes it fit well, thereby reducing the thermal resistance.
This series products offers good thermally conductivity and cost-effectiveness. Its low density is suitable for the current packaging design trend of weight reduction. -
ViaTHERM TFP Series 1~1.5W/m.K Thermal Pad
GBT ViaTHEM TFP is a cost-effective thermal gasket material. Through a specific optimized formula, it has low density characteristics while maintaining excellent thermal performance and easy to operate. The natural viscosity of the material makes it have good adhesion, which reduces the interfacial thermal resistance to a very low level.
This is a kind of heat conduction gap filling gasket with excellent heat conduction performance and cost advantages. Its low density is suitable for the current
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