GBT-ViaTHERM™ TFG SERIES TWO-COMPONENT THERMALLY CONDUCTIVE GEL
Product Features
- 1:1 mix ratio
- Flowable, easy to operate
- Room temperature or thermal curing
- Good insulation properties
- Low thermal resistance
- Easy to repair and rework
- RoHS Compliant
Application
- Automotive Electronic Control Unit (ECU)
- Power and semiconductor equipment
- Memory and power modules
- Microprocessor and graphics processor
- Flat panel displays and consumer electronics
GBT-ViaTHERM TFG series, a soft two-component thermally conductive gel material, has excellent thermal conductivity. Material can be cured at room or elevated temperature. Before curing, the material retains good thixotropic properties and is easy to apply. Its physical appearance is that of a soft cure-in-place pad.
TFG series is ideal for thermal applications where low pressure components that need to be considered, such as sharing a common heating sink/enclosure with multiple heights heat generating components, or applying a heating generating component to an uneven heat sink/enclosure. TFG series realizes the heat dissipation function, at the same time absorbs the height tolerance softly and elastically to protect the components. Since the material is immobile, the product will not flow out of the filling gap. After curing, it is still a low modulus elastomer with excellent electrical properties, water and moisture resistance, weather resistance, and wide temperature range.
| Material # | Unit | TFG2055 | TFG1845LV | TFG2165R | TFG2075 | TFG2640 | TFG3540 | TFG3575P | TFG4845 | TFG6045 | |||||||||
| Component | A | B | A | B | A | B | A | B | A | B | A | B | A | B | A | B | A | B | |
| Colour | Yellow | White | Yellow | White | Yellow | White | Pink | White | Green | White | White | Blue | White | Red | White | Grey | White | Pink | |
| viscosity | cps | 250000 | 120000 | 300000 | 250000 | 270000 | 150000 | 150000 | 350000 | 500000 | |||||||||
| Viscosity after mixing | cps | 250000 | 120000 | 300000 | 250000 | 270000 | 150000 | 150000 | 350000 | 500000 | |||||||||
| Minimum Thickness | mm | 0.05 | 0.08 | 0.05 | 0.05 | 0.06 | 0.05 | 0.08 | 0.05 | 0.10 | |||||||||
| Operating time @25°C | min | 60 | 60 | 60 | 60 | 60 | 60 | 60 | 60 | 60 | |||||||||
| Curing Time@100℃ | min | 10 | 15 | 10 | 15 | 10 | 20 | 30 | 20 | 20 | |||||||||
| Curing Time@25℃ | h | 5 | 6 | 6 | 4 | 6 | 6 | 6 | 8 | 12 | |||||||||
| After Curing | |||||||||||||||||||
| Hardness | Shore 00 | 55 | 45 | 65 | 75 | 40 | 40 | 75 | 45 | 45 | |||||||||
| Thermal Conductivity | W/m·K | 2.0 | 1.8 | 2.1 | 2.0 | 2.6 | 3.5 | 3.6 | 4.8 | 6.0 | |||||||||
| Thermal Resistance @50psi |
℃·in²/W | ≤0.08 | ≤0.08 | / | ≤0.08 | ≤0.07 | ≤0.06 | ≤0.06 | ≤0.04 | ≤0.035 | |||||||||
| Dielectric Strength | kV/mm | ≥10 | ≥12 | ≥15 | ≥15 | ≥12 | ≥10 | ≥15 | ≥9 | ≥9 | |||||||||
| Volume Resistivity | Ω·cm | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10³ | ≥1.0×10¹² | ≥1.0×10¹³ | ≥1.0×10¹² | ≥1.0×10¹² | |||||||||
| Density | g/cm³ | 2.60 | 2.45 | 2.60 | 2.90 | 2.93 | 3.00 | 3.10 | 3.10 | 3.30 | |||||||||
| Dielectric Constant | @1MHz | 6.5 | 6.5 | 6.5 | 6.8 | 6.5 | 7.0 | 7.0 | 8.5 | 7.5 | |||||||||
| CTE ( Coefficient of thermal expansion) |
ppm/℃ | / | 175 | / | / | 160 | 150 | / | / | 135 | |||||||||
| Low Volatile Content (D4 - D20) |
PPM | ≤100 | / | ≤50 | ≤100 | ≤100 | ≤50 | / | ≤30 | ≤30 | |||||||||
| Flammability Rating | UL94 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | |||||||||
| Working Temperature | ℃ | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+150 | |||||||||
| RoHS | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | ||||||||||
