Application Background
Electronic equipment in operation generates electromagnetic radiation, which can cause electromagnetic interference (EMI) to nearby equipment and components.
Application Area
After moisture resistance, high temperature resistance and anti-corrosion treatment, absorber is often used to absorb leaked or unwanted electromagnetic radiation in an anechoic chamber to achieve the purpose of eliminating electromagnetic interference.
Working Mechanism
The basic physical principle of wave absorbing materials: materials can effectively absorb incident electromagnetic waves and convert electromagnetic wave energy into heat or other forms of energy through molecular oscillation. The material should have two properties: impedance matching between electromagnetic waves and the incident medium and attenuation. The impedance matching creates boundary conditions to minimize the reflection coefficient, so that the electromagnetic waves can enter the medium to the greatest extent. Attenuation refers to the loss of wave flux intensity. This is done by the energy conversion formed by molecular oscillation after the electromagnetic wave entering the absorbing material. Two key loss parameters: represented by dielectric loss and electromagnetic loss. To improve the wave-absorbing efficiency of dielectric materials, one approach is to improve the permittivity of the dielectric materials, increase the electric polarization, and at the same time meet the impedance matching conditions, so that the electromagnetic waves are not reflected but absorbed inside the medium. Another approach is to improve the material permeability, which develops the formation of magnetic field. Metals, as conductive absorbents, are generally compounded into other media in the form of ultra-fine powders. It is often difficult to meet impedance matching and good absorption at the same time. GoodBon R&D team developed special compound, to adjust the electromagnetic parameters. GoodBon absorbers, in various formats, improve the RF noise attenuation under the matching conditions.
