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SFG

GBT-ViaTHERM SFG SERIES ONE-COMPONENT THERMALLY CONDUCTIVE GEL

Product Features

  • The perfect combination of extremely low stress and low thermal resistance
  • Weather resistance and good reliability
  • Fully cured without drying
  • Easy dispensing operation, can replace traditional thermal grease
  • RoHS

 

Application

  • Automotive Electronic Control Unit (ECU)
  • Power and semiconductor equipment
  • Memory and power modules
  • Microprocessor and graphics processor
  • Flat panel displays and consumer  electronics

 

GBT-ViaTHERM SFG series thermally conductive gels are specially designed for the heat dissipation requirements of high-performance devices requiring low thermal resistance, in order to achieve optimal heat dissipation performance to ensure the reliability of the device operation. The material is very soft and requires low compression forces, working on mounting surfaces of varying heights, as well as for ultra-thin thermally conductive interface. The stable polymer provides superior long-term stability, which is far more reliable than conventional thermal grease. 
SFG series common packages include syringe, tube or pail. Assembly uses automatic dispensing equipment to precisely control the dosage. Screen printing is also possible. The material can replace thermal pads, improve thermal performance and reduce costs.

 

Material # Unit SFG3000 SFG2000 SFG2000LO SFG3500 SFG4500 SFG6000 SFG7000 SFG7000V SFG8000 SFGX000 SFGX200
Colour   Light Yellow Charcoal Grey Pink Grey Grey Blue Blue Grey Light Grey Aquamarine
Flow Rate
@30cc syringe 0.1 "
needle nozzle, 90Psi
   g/min  26 30 22 22 35 20 22 50 20 15 15
Thermal Conductivity  W/m·K 3.00 2.00 2.00 3.50 4.50 6.00 7.00 7.00 8.00 10.00(12) ≥12.00(≥13)
Thermal Resistance
@20psi
℃·in²/W 0.08 0.10 0.10 0.07 0.06 0.032 0.043 0.03 0.022 0.019 0.015
℃·cm²/W 0.52 0.65 0.65 0.45 0.39 0.210 0.280 0.19 0.140 0.120 0.100
Minimum Thickness  mm 0.08 0.08 0.08 0.08 0.08 0.12 0.15 0.15 0.15 / /
Flammability Rating   V0 V0 V0 V0 V0 V0 V0 V0 V0 V0 V0
Volume Resistivity Ω ·cm ≥1.0×10¹³ ≥1.0×10⁴ ≥1.0×10* ≥1.0×10¹³ ≥1.0×10¹ ≥1.0×10 ≥1.0×10¹¹ ≥1.0×10¹² ≥1.0×10 ≥1.0×10 ≥1.0×10
Dielectric Strength kV(@1mm) / / / >8 / / >6 ≥6 >6 >6 >6
Density g/cm³ 3.00 2.60 2.60 3.05 3.20 3.25 3.40 3.40 3.25 3.35 3.45
Dielectric Constant @1MHz 4.5 5.5 5.5 4.5 5.5 6.5 6.5 6.5 8.5 10.5 8.5
TML(CVCM) % ≤0.20(0.08) ≤0.15(0.05) ≤0.15(0.05) ≤0.15(0.05) ≤0.15(0.05) ≤0.12(0.01) ≤0.12(0.01) ≤0.15(0.05) ≤0.12(0.01) ≤0.20(0.01) ≤0.20(0.01)
Low Volatile Content
(D4 - D20)
ppm <80 <100 <80 <50 <50 <20 <30 / <20 / /
CTE
(Coefficient of
Thermal Expansion)
ppm/℃ / / / / / / 125 150 125 125 125
Working Temperature -60~+200 -60~+200 -60~+200 -60~+200 -60~+200 -60~+150 -60~+150 -60~+150 -60~+150 -60~+150 -60~+150
RoHS   YES YES YES YES YES YES YES YES YES YES YES