GBT-ViaTHERM SFG SERIES ONE-COMPONENT CURABLE THERMALLY CONDUCTIVE GEL
Product Features
- The perfect combination of extremely low stress and low thermal resistance
- Weather resistance and good reliability
- Fully cured without drying
- Easy dispensing operation, can replace traditional thermal grease
- RoHS
Application
- Automotive Electronic Control Unit (ECU)
- Power and semiconductor equipment
- Memory and power modules
- Microprocessor and graphics processor
- Flat panel displays and consumer electronics
GBT-ViaTHERM SFG series thermally conductive gels are specially designed for the heat dissipation requirements of high-performance devices requiring low thermal resistance, in order to achieve optimal heat dissipation performance to ensure the reliability of the device operation. The material is very soft and requires low compression forces, working on mounting surfaces of varying heights, as well as for ultra-thin thermally conductive interface. Curing process brings extra adhesion to application surface. The stable polymer provides superior long-term stability, which is far more reliable than conventional thermal grease.
SFG series common packages include syringe, tube or pail. Assembly uses automatic dispensing equipment to precisely control the dosage. Screen printing is also possible. The material can replace thermal pads, improve thermal performance and reduce costs.
| Material # | Unit | SFG2001 | SFG2002 | SFG3502 | SFG4502 | SFG4501 | SFG6002 | SFG7002 | SFG7001 | SFG8002 |
| Colour | Aquamarine | Aquamarine | Pink | Grey | Grey | Blue | Green | Grey | Grey | |
| Flow Rate @30cc syringe 0.1 " needle nozzle, 90Psi |
g/min | 30 | 30 | 25 | 30 | 30 | 30 | 40 | 60 | 20 |
| Thermal Conductivity | W/m·K | 2.00 | 2.00 | 3.50 | 4.50 | 5.00 | 6.50 | 7.00 | 7.00 | 8.00 |
| Thermal Resistance @20psi |
℃·cm²/W | 0.10 | 0.10 | 0.07 | 0.04 | 0.04 | 0.031 | 0.03 | 0.03 | 0.025 |
| ℃·in²/W | 0.10 | 0.10 | 0.07 | 0.04 | 0.04 | 0.031 | 0.03 | 0.03 | 0.025 | |
| Minimum Thickness | mm | 0.08 | 0.08 | 0.08 | 0.08 | / | 0.20 | 0.30 | 0.30 | / |
| Curing Schedule | min@100℃ | 20 | 20 | 20 | 15 | 30 | 15 | 15 | 30 | 15 |
| Hardness | Shore OO | 45 | 45 | 45 | 40 | 60 | 50 | 40 | 60 | 50 |
| Flammability Rating | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | |
| Volume Resistivity | Ω ·cm | ≥1.0×10¹⁴ | ≥1.0×10¹⁴ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹¹ | ≥1.0×10¹¹ | ≥1.0×10¹¹ | ≥11.0×10¹¹ |
| Dielectric Strength | kV(@1mm) | ≥8 | ≥8 | ≥8 | ≥8 | ≥10 | ≥6 | ≥6 | ≥10 | ≥6 |
| Density | g/cm³ | 2.70 | 2.60 | 3.05 | 3.10 | 3.20 | 3.40 | 3.40 | 3.40 | 3.45 |
| Dielectric Constant | @1MHz | 5.5 | 5.5 | 4.5 | 5.5 | 5.5 | 6.5 | 6.5 | 6.8 | 8.5 |
| TML(CVCM) | % | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.03) | ≤0.15(0.03) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.05) | ≤0.15(0.05) |
| Low Volatile Content (D4 - D20) |
ppm | ≤100 | ≤100 | ≤50 | NONE | / | / | / | / | / |
| CTE (Coefficient of Thermal Expansion) |
ppm/℃ | 165 | 165 | 165 | 150 | / | 150 | 150 | 150 | 150 |
| Working Temperature | ℃ | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -40~+150 | -60~+150 | -60~+150 | -45~+150 | -60~+150 |
| Storage Conditions | ℃ | -25～+0 | +5~+40 | +5~+40 | +5~+40 | -25～-10 | +5~+40 | +5~+40 | -25~-10 | +5~+40 |
| RoHS | YES | YES | YES | YES | YES | YES | YES | YES | YES |
