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TGR

GBT-ViaTHERM TGR SERIES THERMAL GREASE

Product Features

  • Low thermal resistance
  • Slightly fluid to fill the void
  • Stable and compliant with RoHS and
    other environmental requirements

 

Application

  • CPU (laptop, desktop, server)
  • ASIC chips
  • Microprocessor/graphics processor
  • Northbridge chipset
  • Integrated Gate Bipolar Transistor (IGBT)

 

GBT-ViaTHERM TGR series is a high-performance thermal grease based on silicone resin. It has excellent wetting characteristics and can fill the irregular micro-structure on the component surface very well to form a very low thermal resistance interface. It has very good reliability, does not dry, precipitate or harden. Its coating thickness is usually between 0.05-0.15mm. 
TGR is used to solve the problem of heat dissipation of general components. It is in the form of a viscous liquid, which can evenly fill the voids on the components. Material has low thermal resistance, and can be applied by silk screen printing or squeegee coating onto the heat sink or thermal module components. The material complies with RoHS and other environmental requirements, and is friendly to both components and the environment.

 

Material # Unit TGR10 TGR10HV TGR1S TGRZT TGR31 TGR31W TGR4G TGR50
Colour - White White White Gray Gray White Gray Gray
Thermal Conductivity   W/m·K 1.0 1.0 1.5 2.0 3.1 3.1 4.0 5.0
Thermal Resistance ℃·in²/W@50psi 0.025 0.025 0.027 0.023 0.009 0.009 0.010 0.007
℃·cm²/W@50psi 0.161 0.161 0.174 0.148 0.058 0.058 0.065 0.045
Viscosity  cps@23℃ 5.0×104 15.0×104 1.2×10⁵ 8.0×104 1.5×10⁵ 1.5×10⁵ 1.3×10⁵ 2.5×10⁵
Flammability Rating - V0 V0 V0 V0 V0 V0 V0 V0
Volume Resistivity   Ω·cm ≥7.0×10¹¹ ≥7.0×10¹¹ ≥1.0×10¹² ≥9.0×1013 ≥1.0×1010 ≥1.0×1010 ≥1.0×10 ≥1.0×10
Density   g/cm³ 2.50 2.50 2.55 2.60 2.75 2.75 2.82 2.92
Dielectric Constant   @1MHz 5.8 5.8 6.5 6.3 7.5 7.5 7.8 8.5
Working Temperature -50~+150 -50~+150 -50~+150 -50~+150 50~+150 -50~+150 -50~+15 -50~+150
RoHS - Yes Yes Yes Yes Yes Yes Yes Yes