GBT-ViaTHERM PCF SERIES PHASE CHANGE THERMALLY CONDUCTIVE FILM
Product Features
- A variety of thermal conductivity to choose from
- Very low thermal resistance
- Flowable at a specific temperature range
- RoHS compliant
Application
- Automobile electronic control unit
- Power and semiconductors
- Memory and power modules
- Processor/graphics processor
- Flat panel displays and consumer electronics
GBT-ViaTHERM PCF series is a high-performance phase change thermally conductive material designed to meet the requirements of high-end thermal applications, such as high-efficiency processor, thermal module and heat sink. The PCF material provides extremely low thermal resistance between components and heat sinks. The material will undergo melts at 50-57°C and flows but does not overflow. It can squeeze out the air from the gap, thoroughly wet the contact surface, and form a very low thermal resistance.
PCF material is naturally tacky, requires no adhesive layer, is ready to use, and can be die-cut into various shapes, available in sheet or roll format.
| Material # | Unit | PCF3050 | PCF5055 |
| Colour | - | Gray | Gray |
| Thickness | mm | 0.10~0.30 | 0.13~0.30 |
| Thermal Conductivity | W/m·K | 3.00 | 5.0 |
| Thermal Resistance | ℃·in²/W | 0.021(0.1mm@10psi) | 0.019(0.13mm@10psi) |
| 0.016(0.1mm@20psi) | 0.013(0.13mm@20psi) | ||
| 0.013(0.1mm@50psi) | 0.012(0.13mm@50psi) | ||
| Volume Resistivity | Ω·cm | ≥3.0×10¹² | ≥1.0×1010 |
| Phase Change Temperature | ℃ | 50 | 55 |
| Density | g/cm³ | 2.87 | 2.95 |
| Working Temperature | ℃ | -40~+125 | -40~+125 |
| RoHS | - | Yes | Yes |
