GBT-ViaTHERM NFG SERIES SILICONE FREE THERMALLY CONDUCTIVE GEL
Product Features
- The perfect combination of extremely low stress and low
thermal resistance - High reliability and weather resistance
- Silicone-free, suitable for applications that are sensitive
to Siloxane - Fully cured, non-dryingEasy dispensing operation,
can replace traditional thermal grease
Application
- Automotive electronic control unit (ECU)
- Electrical and semiconductors
- Memory and power modules
- CPU/graphics processing unit
- Flat panel displays and consumer electronics
- Application of components sensitive to silicone
GBT ViaTHERM NFG series is a non-silicon based low thermal resistance high performance dispensable thermal interface material specially developed for applications sensitive to Siloxane. The material itself has tackiness properties and at the same time has good wettability, so that the mating parts are fully contacted and the heat transfer efficiency is improved. No curing is required. Material can be easily reworked. This compliant material provides very low compressibility to meet the application requirements of irregular interface, and can be applied to a single component requiring thin thickness, or multiple components sharing same heat sink with different heights.
GBT ViaTHERM NFG series is often packaged in syringes or tubes, and dispensed by automatic dispensing equipment to precisely control the dosage. Screen printing is also possible. The material can replace thermal pads and improve thermal performance and reduce costs.
| Material # | Unit | NFG3500 | NFG4500 |
| Colour | White | White(VIOLET) | |
| Curing Schedule @30cc syringe 0.1" needle nozzle, 90Psi | g/min | 12 | 22 |
| Thermal Conductivity | W/m·K | 3.50 | 4.50 |
| Thermal Resistance @20psi |
℃·in²/W | 0.07 | 0.04 |
| ℃·cm²/W | 0.45 | 0.26 | |
| Minimum Thickness | mm | 0.06 | 0.08 |
| Flammability Rating | 一 |
V0 | V0 |
| Volume Resistivity | Ω·cm | ≥1.0×10¹³ | ≥1.0×10¹³ |
| Dielectric Strength @1mm | kV | ≥8 | / |
| Density | g/cm³ | 3.05 | 3.30 |
| Dielectric Constant | @1MHz | 4.5 | 6.5 |
| TML(CVCM) | % | ≤0.15(0.05) | ≤0.15(0.05) |
| Low Volatile Content (D4~D20) | ppm | / | / |
| CTE (Coefficient of Thermal Expansion) | ppm/℃ | / | / |
| Working Temperature | ℃ | -55~+150 | -55~+150 |
| RoHS | 一 |
Yes | Yes |
