GBT-ViaTHERM TPC SERIES POTTING COMPOUND
Product Features
- Good liquidity, easy to operate
- 1:1 mixing ratio
- Room temperature or thermal curing
- Good insulation performance, temperature and weather resistance
- Wide operating temperature range
- Curing without shrinkage
- Waterproof and moisture proof
- RoHS compliance
Application
- Power Electronics
- Printed circuit board
- Automotive electronics
GBT-ViaTHERM TPC series potting compound is a two-component thermally conductive material with a 1:1 ratio (by weight) between the A and B components. Material can be cured at room or elevated temperatures. The cured material protects the packaged components from environmental impact such as vibration, humidity and salt spray. This highly fluid material can be filled into complex structures and provides functions that cannot be achieved with ordinary thermal pads. The material provides excellent shock and vibration absorbing protection for automotive electronic components.
| Item | Unit | TPC0740 | TPC1050 | TPC1550 | TPC2050 | TPC3055 | TPC1370R | TPC1540R | TPC1865R | ||||||||
| Type | Silicone Thermally Conductive Potting Compound | Silicone Thermally Conductive Potting Compound with Stronger Bonding Feature | |||||||||||||||
| Component | - | A | B | A | B | A | B | A | B | A | B | A | B | A | B | A | B |
| Colour | - | Grey | White | Grey | White | Grey | White | Grey | White | Grey | White | Grey | White | Grey | White | White | Grey |
| Viscosity | cps | 1600 | 1500 | 2900 | 3100 | 6500 | 6500 | 25000 | 25000 | 15000 | 15000 | 7500 | 7500 | 7500 | 7500 | 50000 | 50000 |
| Viscosity after mixing | cps | 1500 | 3000 | 6500 | 25000 | 15000 | 7500 | 7500 | 50000 | ||||||||
| Pot Life @25°C | min | 60 | 60 | 60 | 100 | 90 | 60 | 60 | 60 | ||||||||
| Curing Schedule @100°C | min | 20 | 20 | 20 | 25 | 20 | 15(@150℃) | 20 | 10 | ||||||||
| Curing Schedule @25°C | h | 8 | 8 | 8 | 12 | 12 | 6 | 8 | 20 | ||||||||
| After Mixing | |||||||||||||||||
| Hardness | Shore A | 40 | 50 | 50 | 50 | 55 | 70 | 40 | 65 | ||||||||
| Thermal Conductivity | W/m·K | 0.65 | 1.00 | 1.50 | 2.00 | 3.00 | 1.30 | 1.50 | 1.80 | ||||||||
| Bonding Strength@AL | MPa | - | - | - | - | - | ≥3.5 | ≥3.5 | ≥1.05 | ||||||||
| Dielectric Strength@1mm | kV | ≥15 | ≥15 | ≥12 | ≥13 | ≥13 | ≥15 | ≥15 | ≥15 | ||||||||
| Volume Resistivity | Ω·cm | ≥1.0×10¹⁴ | ≥1.0×10¹⁴ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹⁴ | ≥1.0×10¹³ | ≥1.0×10¹³ | ≥1.0×10¹³ | ||||||||
| Density | g/cm³ | 1.50 | 1.58 | 2.25 | 2.75 | 2.95 | 2.20 | 2.25 | 2.70 | ||||||||
| Tensile Strength | psi | - | - | - | - | - | 55 | 55 | ≥1.2MPa | ||||||||
| Elongation | % | - | - | - | - | - | 20 | 20 | 10 | ||||||||
| Young's Modulus | psi | - | - | - | - | - | 115 | 115 | - | ||||||||
| Dielectric Constant | @1MHz | 3 | 3.5 | 4.5 | 6.5 | 5.5 | 4.5 | 4.5 | 5.5 | ||||||||
| Flammability Rating | UL94 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | ||||||||
| Working Temperature | ℃ | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -50~+200 | -55~+200 | ||||||||
| CTE | ppm/℃ | - | 50 | - | - | - | 125 | 125 | - | ||||||||
| RoSH | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | |||||||||
