ViaTHERM TFP Series 2.2 - 3.0W/m.K Thermal Pad
Product Features
- Thermal conductivity 2.2 - 3.0w/m · K
- Self adhesive
- UL94 V-0 flame retardant grade
- Thickness range: 0.003 inch (0.07mm) -0.400 inch (10.0mm)
Application
- Desktop computer, laptop and server
- LED lighting equipment
- Automotive electronics
- LCD and PDP flat display
- Automotive electrical modules, battery heat dissipation
GBT ViaTHERM TFP series thermal pads are cost-effective. With special formulation, pads have low density while maintaining excellent thermal performance and being easy to handle. The natural tackiness of the material makes it fit well, thereby reducing the thermal resistance.
This series products offers good thermally conductivity and cost-effectiveness. Its low density is suitable for the current packaging design trend of weight reduction.
For the special convenience of use and rework, a non-sticky "dry surface" can be formed on one side through a unique process. The thermal pads' non-tacky side can be easily removed from IC chips, PCB or other components without any damage. The other tacky side is usually applied to heat sink/cold plate/housing for heat dissipation.
| Material # | Unit | TFP2250 | TFP2225 | TFP2240LV | TFP2850 | TFP2830HT | TFP3050 | TFP3035LV | TFP3045LD | TFP3025LB |
| Colour | - | Charcoal | Grey | Grey | Light Blue | Light Blue | Grey | Light Blue | Violet | Light Blue |
| Thickness | mm | 0.15~10 | 0.15~10 | 0.15~10 | 0.2~10 | 0.2~10 | 0.2~10 | 0.2~10 | 0.3~10 | 0.2~10 |
| Thermal Conductivity | W/m·K | 2.2 | 2.2 | 2.2 | 2.8 | 2.8 | 3 | 3 | 3 | 3 |
| Thermal Resistance @1mm，20psi | ℃·in²/W | 0.75 | 0.65 | 0.7 | 0.46 | 0.42 | 0.42 | 0.42 | 0.35 | 0.42 |
| ℃·cm²/W | 4.85 | 4.19 | 4.52 | 2.97 | 2.7 | 2.71 | 2.71 | 2.26 | 2.71 | |
| Hardness | Shore00 | 50 | 25 | 40 | 50 | 30 | 50 | 35 | 45 | 25 |
| Flammability Rating | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | |
| Breakdown Voltage | kV(@1mm) | >9.0 | >9.0 | ≥10.0 | >9.0 | >9.0 | >9 | >9.0 | >10 | >9.0 |
| Volume Resistivity | Ω ·cm | ≥3.0×1013 | ≥3.0×1013 | ≥3.0×1013 | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | ≥2.0×1013 | ≥1.0×1013 |
| Density | g/cm³ | 2.6 | 2.6 | 2.6 | 3 | 3 | 3 | 3 | 1.6 | 3 |
| Tensile Strength | psi | 36 | 32 | / | 60 | 50 | 52 | 35 | 40 | 50 |
| Elongation | % | 55 | 58 | / | 55 | 58 | 57 | 58 | 65 | 58 |
| Compression Ratio (%, at given pressure) | 10psi | 12 | 28 | 15 | 12 | 25 | 12 | 20 | 25 | 23 |
| 50psi | 42 | 55 | 47 | 35 | 52 | 42 | 48 | 52 | 50 | |
| 100psi | 58 | 86 | 69 | 48 | 84 | 56 | 75 | 85 | 83 | |
| Dielectric Constant | @1MHz | 7.5 | 7.5 | 7.5 | 5.5 | 5.5 | 5.5 | 5.5 | 3 | 5.5 |
| Low Volatile Content (D4~D20) |
ppm | / | / | / | / | / | / | / | <80 | / |
| TML(CVCM) | % | ≤0.32(0.08) | ≤0.32(0.08) | ≤0.32(0.08) | ≤0.20(0.05) | ≤0.20(0.05) | ≤0.18(0.05) | ≤0.20(0.05) | ≤0.15(0.05) | ≤0.20(0.05) |
| Working Temperature | ℃ | -60~+200 | 60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 |
| RoHS | YES | YES | YES | YES | YES | YES | YES | YES | YES |
