ViaTHERM TFP Series 1~1.5W/m.K Thermal Pad
Product Features
- Thermal conductivity 1~1.5w/m · K
- Self adhesive
- UL94 V-0 flame retardant grade
- Thickness range: 0.003 inch (0.07mm) -0.400 inch (10.0mm)
Application
- Desktop computer, laptop and server
- LED lighting equipment
- Automotive electronics
- LCD and PDP flat display
- Automotive electrical modules, battery heat dissipation
GBT ViaTHEM TFP is a cost-effective thermal gasket material. Through a specific optimized formula, it has low density characteristics while maintaining excellent thermal performance and easy to operate. The natural viscosity of the material makes it have good adhesion, which reduces the interfacial thermal resistance to a very low level.
This is a kind of heat conduction gap filling gasket with excellent heat conduction performance and cost advantages. Its low density is suitable for the current trend of electronic equipment weight reduction.
In order to facilitate use and rework, a non sticky "dry surface" can be formed on one side through a unique process to match the customer's specific use occasions. For example, when the "dry surface" of the heat-conducting gasket contacts the chip and PCB board, it can be quickly and easily disassembled and undamaged; another naturally sticky surface of the heat-conducting gasket is usually bonded to the radiator / cold plate / shell, etc.
| Material # | Unit | TFP1025 | TFP1005-EB | TFP1025-EB | TFP1055 | TFP1255 | TFP1545 | TFP1525LV | FP1525-PI | TFP1505-EB |
| Colour | - | White | White / Pink | White / Pink | Grey | Grey | Aquamarine | Aquamarine | Aquamarine | White / Bromw |
| Thickness | mm | 05~10 | 0.5~10 | 0.5~10 | 0.07~10 | 0.07~10 | 0.07~10 | 0.07~10 | 0.15~10 | 0.5~10 |
| Thermal Conductivity | W/m·K | 1.0 | 1.0 | 1.0 | 1.0 | 1.2 | 1.5 | 1.5 | 1.5 | 1.5 |
| Thermal Resistance @1mm，20psi |
℃·in²/W | 1.16 | 1.01 | 1.16 | 1.25 | 1.15 | 0.98 | 0.90 | 0.96 | 0.95 |
| ℃·cm²/W | 7.47 | 6.52 | 7.47 | 8.06 | 7.42 | 6.32 | 5.81 | 6.19 | 6.13 | |
| Hardness | Shore00 | 25 | 5 | 25 | 55 | 55 | 45 | 25 | 25 | 5 |
| Flammability Rating | - | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 | V0 |
| Breakdown Voltage | kV(@1mm) | >10.0 | >12.0 | >12.0 | >12.0 | >10.0 | >10.0 | >10.0 | >12.0 | >12.0 |
| Volume Resistivity | Ω ·cm | ≥1.0×1012 | ≥1.0×1012 | ≥1.0×1012 | ≥1.0×1013 | ≥4.0×1013 | ≥5.0×1013 | ≥5.0×1013 | ≥5.0×1013 | ≥5.0×1013 |
| Density | g/cm | 1.60 | 1.60 | 1.60 | 1.3 | 1.75 | 1.85 | 1.85 | 1.85 | 1.85 |
| Tensile Strength | psi | / | 10 | / | 48 | 48 | 30 | 30 | ≥200 | ≥300 |
| Elongation | % | / | / | 55 | 60 | 55 | 55 | 15 | 15 | |
Compression Ratio (%, at given pressure) |
10psi | 22 | 25 | 15 | 12 | 10 | 8 | 18 | 18 | 32 |
| 50psi | 54 | 60 | 40 | 40 | 42 | 38 | 46 | 46 | 58 | |
| 100psi | 75 | 86 | 58 | 58 | 58 | 55 | 62 | 62 | 82 | |
| Dielectric Constant | @1MHz | 5.5 | 5.5 | 5.5 | 4.5 | 5.5 | 6.2 | 6.2 | 6.2 | 6.2 |
| Low Volatile Content (D4~D20) |
ppm | / | / | / | / | / | / | / | / | / |
| TML(CVCM) | % | ≤0.35(0.12) | ≤0.35(0.12) | ≤0.35(0.12) | ≤0.55(0.25) | ≤0.35(0.10) | ≤0.55(0.10) | ≤0.55(0.10) | ≤0.55(0.10) | ≤0.55(0.10) |
| Working Temperature | ℃ | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 | -60~+200 |
| RoHS | YES | YES | YES | YES | YES | YES | YES | YES | YES |
