GBT-eSEAL EC (Electrically Conductive Elastomer Product)
Product Benifit
- Ultra-low resistance and excellent shielding performance are
achieved after proper compression - Excellent environmental sealing, up to Ip68
- Excellent mechanical properties, softness, and resilience
- Easy customization, fast samples in sheet, strip, customized
shape, by die cutting, molding, extrusion
Product application
- Communication equipment
- Automotive electronics
- Medical instrument
- IO dust control
- Server
Material Selection
Material selection is based on the designer's requirements for performance and cost. For example, GBT-eSEAL EC2320 (Ag/Al, fluorosilicone) with excellent shielding and corrosion resistance. It can greatly improve the reliability and service life of the product. This material is suitable for harsh aerospace applications. For industrial grade applications, the high conductivity of eSEAL EC2310 (Ag/Al, silicone),
Ec2410 (Ag/G, silicone) and EC2510 (Ag/Cu, silicone) are suitable for higher level shielding requirements and good grounding applications. EC2110 is a nickel-carbon filled conductive rubber with a particular cost advantage and low weight, suitable for commercial and general consumer electronics applications. For the materials mentioned in the list (Table 1), the products can be extruded, molded, diecut and overmolded with metal parts by GoodBon. For customers' customization needs, molding process not only meet customers' needs of mass production, but also meet the small batch order for engineering in design variation.
Heat sink is a thin sheet radiator made of special materials, which is mainly used to evenly distribute the heat in electronic devices to a larger heat dissipation area to improve heat dissipation efficiency. Compared with traditional radiators, soaking sheets have higher heat dissipation performance and smaller volume, so they are widely used in a variety of high-heat electronic equipment and compact equipment.
First, the main feature of the soaking sheet is its efficient heat dissipation performance. Due to its special material and structural design, the soaking sheet can quickly and evenly transfer the heat in the electronic device to the various parts of the radiator, thus greatly improving the heat dissipation efficiency. This makes the soaking sheet an effective solution for dealing with high heat problems, especially for equipment with high heat dissipation performance requirements.
Secondly, the advantage of soaking sheet is its thin and small size and weight. Because of its sheet-like structure, the soaking sheet can be made very thin and light, so it has a wide range of application prospects in compact devices and mobile devices. In addition, due to its small size and weight, the soaking sheet is also easy to install and integrate, and can be adapted to a variety of compact equipment layout and design requirements.
Third, the application scenario of soaking sheet is very wide. It can be applied to a variety of fields that need to deal with high heat problems, such as computer hardware, communication equipment, electronic measuring instruments, etc. In these fields, the soaking sheet, with its efficient heat dissipation performance and thin and small size, has become an important part of the compact and miniaturized equipment.
In addition, the soaking sheet has two main material choices of stainless steel and pure copper. Stainless steel has high strength and corrosion resistance, suitable for high heat dissipation performance and the environment is harsh occasions; The pure copper has high thermal conductivity and good processing performance, and is suitable for occasions with high heat dissipation performance requirements. Users can choose the right materials according to the actual needs.
In general, as an efficient, thin and compact type of heat sink, the soaking sheet has significant advantages in dealing with high-incidence heat problems and compact and miniaturized equipment. It is widely used in various fields and provides a reliable guarantee for the stable operation of electronic equipment and compact equipment. Whether it is high-performance computer hardware that requires efficient heat dissipation, or mobile communication equipment that has strict requirements for thickness and weight, the heat sink can provide excellent heat dissipation solutions.
| EC Material # | EC2010 | EC2110 | EC2210 | EC2310 | EC2320 | EC2410 | EC2510 | EC2710 | Test Method | |
| Substrate | Silicone | Silicone | Silicone | Silicone | Fluorosilicone | Silicone | Silicone | Silicone | N/A | |
| Conductive Particle | C | Ni/C | Ni/Al | Ag/Al | Ag/Al | Ag/G | Ag/Cu | Ag | N/A | |
| Color | Black | Black | Gray | Taupe | Blue | Taupe | Taupe | Taupe | Visual | |
| Density (g/cm³) | 1.2 | 1.9 | 2.4 | 2.2 | 2.2 | 2.0 | 3.5 | 4.3 | ASTM D792 | |
| Volume Resistivity | 3.0 | 0.1 | 0.1 | 0.008 | 0.012 | 0.006 | 0.004 | 0.002 | MIL-DTL-83528C | |
| Volume Resistivity (Shore A) | 70 | 65 | 75 | 65 | 60 | 65 | 60 | 70 | ASTM D2240 | |
| Tensile Strength (PSI) | 700 | 200 | 200 | 180 | 120 | 200 | 200 | 150 | ASTM D412 | |
| Elongation (%) | 200 | 150 | 150 | 150 | 120 | 150 | 150 | 100 | ASTM D412 | |
| Tear Strength (PPI) | 80 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | ASTM D624 | |
| Shielding Effectiveness (dB) |
500M | 60 | 100 | 110 | 110 | 105 | 100 | 120 | 130 | MIL-DTL-83528C |
| 2G | 60 | 100 | 105 | 105 | 100 | 100 | 120 | 130 | ||
| 10G | 60 | 100 | 100 | 100 | 100 | 100 | 120 | 130 | ||
| Working Temperature (℃) | -55~170 | -55~170 | -55~170 | -55~170 | -55~170 | -55~170 | -55~170 | -55~170 | ASTM D1329 | |
