Contact Spring
APPLICATION
- PCB grounding (handheld devices, telecommunication equipment)
- Optics
- Automotive on-board controller PCB grounding
- Laptop internal mechanical parts
- EMI shield
DESIGN CONSIDERATIONS
- Produc assembly method. (soldering, screw, clip, etc.)
- Product operation height and part height. (involving material elasticity and usage requirements, focusing on evaluating failure risk)
- Work environment and corrosion resistance. (Selection of material and plating)
- SMT automation requirements. (packaging selection and T&R design)
- Working current and voltage. (considering the cross-section area and material)
- Product structural space. (product structure selection )
- Product reliability testing. (such as compression frequency and compression reflection requirements)
CHARACTERISTICS OF BERYLLIUM COPPER
- Beryllium copper is an alloy with high conductivity.
- Due to its high heat transfer and conductivity, beryllium copper can be used in applications such as heat dissipation and signal transmission.
- Compared to traditional alloys, beryllium copper has lower density and higher strength.
- The excellent processability of beryllium copper makes it suitable for various types of products.
SMD CONTACT FEATURES
- High reliability, long service life, and can withstand high temperature and humidity environments.
- Automated production, significantly reducing assembly costs.
- Low impedance, achieving good EMI & ESD shielding effect.
- Due to its excellent elasticity, it can be designed for use in various lightweight, small-size, or complex structures.
