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Dingtalk_20211208193744
Dingtalk_20211208193744
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GBT-mZORB™ HW1060

GoodBon's mZORBTM DW1060 is designed to meet critical requirements of heat dissipation, RF absorption performance, low compression force and environment reliability. This gel-like material also has excellent compressibility and conformability, making it easier to adhere closely to electronic components, while filling the microscopic uneven surface so that the mating parts can fully contact and improve Heat transfer efficiency. It is a pre-cured material, will  provides superior long-term performance stability and reliable performance which is better than thermal greases.

GoodBon mZORB™ HW1060 is designed to meet critical requirements of heat dissipation, RF absorption performance, low compression force and environment reliability. This gel-like material also has excellent compressibility and conformability, making it easier to adhere closely to electronic components, while filling the microscopic uneven surface so that the mating parts can fully contact and improve heat transfer efficiency. It is a pre-cured material, will provides superior long-term performance stability and reliable performance. This unique product can be considered in many mechanical structure constrained applications. Automated dispensing provides additional savings and quality control.

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Product Description
Parameters

Product Features 

  • Thermal conductivity 6.0 W/m·k
  • Hybrid RF absorptive & thermal conductive function
  • Low thermal resistance
  • Low out-gassing
  • Low compression force
  • Long-term reliability
  • RoHS compliant

 

Applications 

  • Automotive Electronic Control Units
  • Semiconductors
  • Optical Module
  • Microprocessors / Graphics Processors
  • Telecom/Networking
  • Comsumer Electronics

 

Packaging preparation

  • 30cc, 55cc, 300cc Syringe
  • 1kg, 10kg pail

Performance Curve

1

 

Product Number Definition Rules

Characteristic Unit Test Method DW1060
Colour - Visual inspection Grey
Flow rate g/min Goodbon 25
Thermal conductivity W/m·K Hot Disk 6.0
ASTM D5470 6.0
Thermal resistance
(@20psi)
°C·in²/W ASTM D5470 0.032
°C·cm²/W 0.206
Minimum working thickness mm Goodbon 0.08
Flame rating - UL 94V-0
Volume resistivity Ω·cm ASTM D257 ≥1.0X109
Dielectric constant (@1MM) kV ASTM D149 >4.5
Density g/cm³ ASTM D792 3.9
TML (CVCM) % ASTM E595 ≤0.12(0.01)
Low volatile components (D4-D20) ppm Gas Chromatograph <20
Thermal expansion coefficient ppm/°C ASTM E831 135
Operating temperature °C Boodbon -60~+200
RoHS compliance - Goodbon YES
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