GoodBon mZORB™ HW1060 is designed to meet critical requirements of heat dissipation, RF absorption performance, low compression force and environment reliability. This gel-like material also has excellent compressibility and conformability, making it easier to adhere closely to electronic components, while filling the microscopic uneven surface so that the mating parts can fully contact and improve heat transfer efficiency. It is a pre-cured material, will provides superior long-term performance stability and reliable performance. This unique product can be considered in many mechanical structure constrained applications. Automated dispensing provides additional savings and quality control.
Product Number Definition Rules
|Thermal conductivity||W/m·K||Hot Disk||6.0|
|Minimum working thickness||mm||Goodbon||0.08|
|Volume resistivity||Ω·cm||ASTM D257||≥1.0X109|
|Dielectric constant (@1MM)||kV||ASTM D149||>4.5|
|TML (CVCM)||%||ASTM E595||≤0.12(0.01)|
|Low volatile components (D4-D20)||ppm||Gas Chromatograph||＜20|
|Thermal expansion coefficient||ppm/°C||ASTM E831||135|
Depending on strong technical support and comprehensive production capacity, we provide various printed label products and precision die-cuts quickly (within 1-3 days). * Material Options: Tapes, Insulating PC/PP/PET, Foam, Rubber, Aluminium, Copper foil and thermal/Electrical condutive materials; * Manufacturing capabilities: Digital printing, Screen printing, Thermal Forming, Precision Die-cutting, Stamping & Punching, CNC routing, Lamination & Slitting and assembly service. * Color Management: X-rite 7600 chromatometer.
GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.
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