eSEAL™ EP(Electrically Plated Seal)
eSEAL™ EP(Electrically Plated Seal) gasket is a unique product of a non-conductive elastomer core with its skin coated with conductive layer. This structure ensure a good elasticity of its core, which can achieve both environmental sealing and easily assembly, at the same time it will also offer excellent EMI shielding properties for various applications.
Features and advantages
|characteristic||unit||standard Test||EP2410 Conductive Filler||EP2410 Core||
|material ingredient||-||-||Ag/G||NC1010 silicone rubber||Ag/Ni||NC1010 silicone rubber|
|500M||dB||MIL-DTL-83528C, Para. 4.5.12||100||-||100||-|
|hardness||Shore A||ASTM D2240||60||55||60||55|
|Tensile Strength||psi||ASTM D412||180||900||200||900|
|Elongation at break||%||ASTM D412||150||300||150||300|
|Tear strength||PPI||ASTM D624||30||60||30||60|
|Surface resistance/ 85RH&85℃||Ohm||MIL-DTL-83528C||20||-||20||-|
|Surface resistance / heating and cooling cycle||Ohm||MIL-DTL-83528C||20||-||20||-|
|Compression set||%||ASTM D395-B||20||12||25||12|
|Static pressure-pressure curve with φ0.7mm Solid O-tyoe Strip test|
|40% compression||N/cm||QA-WI-FIP-003||twenty one||6|
|Operating temperature||°C||ASTM D1329||-55~+160||-55~+160|
Depending on strong technical support and comprehensive production capacity, we provide various printed label products and precision die-cuts quickly (within 1-3 days). * Material Options: Tapes, Insulating PC/PP/PET, Foam, Rubber, Aluminium, Copper foil and thermal/Electrical condutive materials; * Manufacturing capabilities: Digital printing, Screen printing, Thermal Forming, Precision Die-cutting, Stamping & Punching, CNC routing, Lamination & Slitting and assembly service. * Color Management: X-rite 7600 chromatometer.
GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.
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