Search
English
Homepage
>
Product Center
>
Thermal Interface Material
>
TFP: Thermal pad
>
TFP1055-00
截屏2021-12-23 上午7.21.45
截屏2021-12-23 上午7.21.45
名称

TFP1055-00

GBT-ViaTHERM TFP1055-00 is a 1.0 W/m∙K, ultra-soft and tear-proof thermal gap filler, recommended for applications that require a minimum amount of pressure on components. TFP1055-00 is an electrically isolating material, which allows its use in applications requiring isolation between heatsinks and high voltage devices.
Retail price
0.0
元
Market price
0.0
元
Number of views:
1000
Product serial number
Category
TFP: Thermal pad
Quantity
-
+
Stock:
0
1
Product Description
Parameters
Key Properties
  • Thermal conductivity 1.0 W/m·K
  • Thickness from 0.020” (0.50mm) to 0.400” (10.0mm)
  • Super soft and compressible, used in low-stress applications, the
  • material has its own viscosity, and can be reused.
 
Applications 
  • Automotive electronic control units.
  • (ECU)power supply and semiconductor 
  • Memory and power supply module
  • Microprocessor/graphics processor
  • Flat panel display and consumer electronics

Product characteristics 

 

 

Characteristic

Unit

Testing Method

TFP1055-00

Colour

-

Visual Inspection

White/Pink

Thickness

mm

ASTM D374

0.50~10.0

Thermal Conductivity

W/m·K

Hot Disk

1.00

ASTM D5470

1.00

Thermal Resistance
(@1mm,20psi)

°C·in²/W

ASTM D5470

1.01

°C·cm²/W

6.52

Hardness

Shore OO

ASTM D2240

5

Flame Retardant 

-

UL

94V-0

Withstand Voltage Strength (@1MM)

kV

ASTM D149

>10.0

Volume Resistivity

Ω·cm

ASTM D257

≥1.0X10 12

Density

g/cm³

ASTM D792

1.60

Tensile Strength

psi

ASTM D412

10

Elongation

%

ASTM D412

-

Compression Set
(%, specified pressure)

10psi

ASTM D575

25

50psi

60

100psi

86

Dielectric Constant

@1MHz

ASTM D150

5.5

TML(CVCM)

%

ASTM E595

≤0.35(0.12)

Operation temperature

°C

GoodBon

-60~200

RoHS 

-

GoodBon

YES
Previous
TFP2850-00
Next
TFP1255-00

Download

There is currently no content to display
Please add data record on website background.

MORE PROUDCTS

mZORB™ WA1000

mZORB™ WA1000
Die-Cutting & Label Printing

Depending on strong technical support and comprehensive production capacity, we provide various printed label products and precision die-cuts quickly (within 1-3 days).  * Material Options:  Tapes, Insulating PC/PP/PET, Foam, Rubber, Aluminium, Copper foil and thermal/Electrical condutive materials; * Manufacturing capabilities: Digital printing, Screen printing, Thermal Forming, Precision Die-cutting, Stamping & Punching, CNC routing, Lamination & Slitting and assembly service. * Color Management:  X-rite 7600 chromatometer.

Die-Cutting & Label Printing
EB5000

EB5000
Automotive: ABS or ESC/ECU Assembly

Automotive: ABS or ESC/ECU Assembly
Scalable Automation Solutions

Scalable Automation Solutions
TFPX255-00

TFPX255-00
TFP8050-00

GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.

TFP8050-00
TFP6050-00

TFP6050-00

MESSAGES

 

If you have any good suggestions and comments on our company, or want to consult our products, please fill in the form below, and we will contact you at the first time!

Username used for comment:
客户留言
Description:

Pls input your email address here

Contact

固邦科技 固邦科技 固邦科技
© 2020 GoodBon All rights reserved 粤ICP备2021136137号 Powered by 300.cn