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TFP1255-00
Dingtalk_20211208173911
Dingtalk_20211208173911
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TFP1255-00

GBT-ViaTHERM TFP1255-00 is a cost-effective, thermal gap pad, with an ideal filler blend that gives it low modulus maintaining optimal thermal performance while allowing easy handling.  The natural tack on both sides of the material allows good compliance to adjacent surfaces of components, minimizing interfacial resistance. The gap filler allows the product to remain a cost effective solution in which moderate thermal performance is acceptable.
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TFP: Thermal pad
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Product Description
Parameters

Key Properties

  • Thermal conductivity 1.2 W/m·K
  • Low deformation force, more effective protection of electrical components with their own adhesion, generally no additional adhesive
  • V-0 flame retardant grade
  • thickness range 0.003” (0.07mm)-0.400” (10.0 mm)
 
Applications 
  • Desktop, portable computer and server
  • LED lighting equipment
  • automotive electronic equipment
  • LCD and PDP flat panel display
  • automotive electronic products, battery heat dissipation

Product characteristics 

 

 

Characteristic

Unit

Testing Method

TFP1255-00

Colour

-

Visual Inspection

Grey

Thickness

mm

ASTM D374

0.07~10.0

Thermal Conductivity

W/m·K

Hot Disk

1.20

ASTM D5470

1.20

Thermal Resistance
(@1mm,20psi)

°C·in²/W

ASTM D5470

1.15

°C·cm²/W

7.42

Hardness

Shore OO

ASTM D2240

55

Flame Retardant 

-

UL

94V-0

Withstand Voltage Strength (@1MM)

kV

ASTM D149

>10.0

Volume Resistivity

Ω·cm

ASTM D257

≥4.0X10 13

Density

g/cm³

ASTM D792

1.75

Tensile Strength

psi

ASTM D412

48

Elongation

%

ASTM D412

60

Compression Set
(%, specified pressure)

10psi

ASTM D575

10

50psi

42

100psi

58

Dielectric Constant

@1MHz

ASTM D150

5.5

TML(CVCM)

%

ASTM E595

≤0.35(0.12)

Operation Temperature

°C

GoodBon 

-60~200

RoHS 

-

GoodBon 

YES
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