Applications

• Various PCB grounding (mobile phones, communication equipment),
• optical components,
• automotive motherboard grounding,
• notebook computer internal structure
• shielding cover positioning or wire positioning

Design considerations for grounding shrapnel

1: The way of product positioning. (Welding, screws, buckles, etc.)
2: The working height and design height of the shrapnel. (Involving material elasticity and use requirements, focus on evaluating whether there is a risk of failure)
3: Working environment requirements and corrosion resistance. (Select material and coating)
4: SMT automation demand. (Packaging method selection and carrier tape design)
5: The working current and voltage used. (Product cross-sectional area size and material)
6: Product structure space. (Selection of the structure of the shrapnel)
7: Product reliability test. (Such as compression times, compression rebound requirements)

Advantages of SMD shrapnel

• High reliability, long life, and can withstand high temperature and humidity environment.
• Automated production greatly reduces labor costs.
• Low impedance, can achieve good EMI&ESD effects.
• It has good formability, so it can be designed flexibly and suitable for all kinds of light, thin, short, or complex mechanisms.

Selection Guide