Applications

• Various PCB grounding (mobile phones, communication equipment),
• optical components,
• automotive motherboard grounding,
• notebook computer internal structure
• shielding cover positioning or wire positioning

Design Tips:

1. The way of product positioning. (Welding, screws, buckles, etc.)
2. The working height and design height of the shrapnel. (Involving material elasticity and use requirements, focus on evaluating whether there is a risk of failure)
3. Working environment requirements and corrosion resistance. (Select material and coating)
4. SMT automation demand. (Packaging method selection and carrier tape design)
5. The working current and voltage used. (Product cross-sectional area size and material)
6. Product structure space. (Selection of the structure of the shrapnel)
7. Product reliability test. (Such as compression times, compression rebound requirements)

Advantages:

• High reliability, long life, and can withstand high temperature and humidity environment.
• Automated production greatly reduces labor costs.
• Low impedance, can achieve good EMI&ESD effects.
• It has good formability, so it can be designed flexibly and suitable for all kinds of light, thin, short, or complex mechanisms.

Selection Guide