Features and advantages

• 1. It can be supplied with T/R package;
• 2. It can be customized and designed according to customer requirements.
• 3. Efficient prototype process

Applications

• PCB components that require shielding protection.
• Reliable cover design, can withstand vibration and impact

Shield selection attention

• Electroplating options-SMT demand
• pre-tinned material---low cost
• barrel plating---low cost
• rack plating---high cost

The structure design chooses

• buckle assembly,
• strength,
• heat dissipation,
• shielding effect,
• assembly gap,
• pad location size,
• Great Wall entrance, etc.;

Material selection:

• white copper
• pre-plated material, tinplate
• pre-plated stainless
• steel, stainless steel (only for Cover)

Packaging method-

• 1. T/R packaging for automatic assembly requirement 
• 2. Tray package: suitable for small batches and high flatness requirements
• 3. PE bag: suitable for small batches and low flatness requirements

Meet the requirements of reflow flow test

• Peak test temperature: 255℃
• Test time: 2-5 minutes

Mold process selection

• Stretching process: no gaps in the four corners, better shielding requirements.          
• Multi-layer stretch steps: to meet different structural spaces
• Automatic assembly in the mold. Removable shielding: automatic realization of different structural requirements