eMetal™ SP2000 SFP CONN
SP2000 SFP CONN metal to provide a better solution to eliminate EMI noise from SFP/XFP transceivers. This shielding method will effectively improve the overall performance of a optical transceiver, at the same time, not increase assembly cost and additional material cost. As result of put on SP2000 stamping metals, the gap between the mating interface will be filled up, and the pressure block can be eliminated, effectively improving the overall electromagnetic shielding performance of the SFP/XFP modules.
Mainly used for shielding on optical communication switches, other square side pressure shielding structures can also be applied.
|Part code||Sectional features/simplified drawings||Specification (mm)||Material||Plug life||Surface treatment|
|SP-2001||55.4*13.8*9.51||Beryllium copper 1/4H T=0.05||More than 1000 times||Nickel plated|
|SP-2002||81.6*13.6*9.3||Beryllium copper 1/2H T=0.1||More than 1000 times||True color|
|SP-2003||81.8*13.8*9.0||SUS301 1/2H T=0.1||500 times or more||True color|
|SP-2004||68.2*13.9*9.3||SUS301 1/2H T=0.1||500 times or more||True color|
|SP-2005||64.7*12.3*4.4||SUS301 1/2H T=0.1||500 times or more||True color|
|SP-2006||36.9*14.55*8.3||SUS301 1/2H T=0.1||500 times or more||True color|
Depending on strong technical support and comprehensive production capacity, we provide various printed label products and precision die-cuts quickly (within 1-3 days). * Material Options: Tapes, Insulating PC/PP/PET, Foam, Rubber, Aluminium, Copper foil and thermal/Electrical condutive materials; * Manufacturing capabilities: Digital printing, Screen printing, Thermal Forming, Precision Die-cutting, Stamping & Punching, CNC routing, Lamination & Slitting and assembly service. * Color Management: X-rite 7600 chromatometer.
GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.
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