Thermal Interface Material_Product Center

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Thermal Interface Material

GoodBon® Technology’s ViaTHERM™ thermal interface material (TIM) product family includes: thermal pad, thermally conductive gels, thermally conductive structural bonding and potting encapsulates, and thermally conductive composite functional materials; through a rich product portfolio, we are dedicated to serving the four major industries of Automotive Electronics, Telecom & Datacom, consumer electronics, and industrials. Our R&D team has an average of more than 10 years of experience in the industry, and has formed long-term R&D cooperation with many universities and research institutions to ensure that our products and solutions are at the leading level in the industry.

EB5000

TFPX255-00

GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.

TFP8050-00

TFP6050-00