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TFP1545-00
截屏2021-12-23 上午7.23.16
截屏2021-12-23 上午7.23.16
名称

TFP1545-00

GBT-ViaTHERM TFP1545-00 is a very soft, freestanding thermal gap. As a perfect blend of good thermal conductivity of 1.5 W/m·K and high conformability, this material produces low thermal resistance. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with all different kins of stepped topography, rough surfaces or high stack-up tolerances.
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Category
TFP: Thermal pad
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Product Description
Parameters
Key Properties
  • Thermal conductivity 1.5 W/m·K,
  • low hardness, high conformability and
  • high adhesive surface, reducing contact thermal resistance,
  • electrical insulation, and V-0 flame retardant grade.
  • Thickness range of 0.003” (0.07mm) to 0.400” (10.0mm)
 
Applications
  • Desktops, portable computers and servers,
  • LED lighting equipment,
  • Electronic communication equipment,
  • LCD and PDP flat panel displays,
  • Automotive electronics, battery cooling

Product characteristics 

 

 

Characteristic

Unit

Testing Method

TFP1545-00
Colour - Visual Inspection Light Green
Thickness mm ASTM D374 0.07~10.0
Thermal Conductivity W/m·K Hot Disk 1.50
ASTM D5470 1.50
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.98
°C·cm²/W 6.32
Hardness Shore OO ASTM D2240 45
Flame Retardant  - UL 94V-0
Withstand Voltage Strength (@1MM) kV ASTM D149 >10.0
Volume Resistivity Ω·cm ASTM D257 ≥5.0X10 13
Density g/cm³ ASTM D792 1.85
Tensile Strength psi ASTM D412 30
Elongation % ASTM D412 55
Compression set
(%, specified pressure)		 10psi ASTM D575 32
50psi 58
100psi 82
Dielectric Constant @1MHz ASTM D150 6.2
TML(CVCM) % ASTM E595 ≤0.55(0.10)
Operation temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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