eMetal™ SP1000 I/O CONN
eMetal™ SP1000 I/O CONN, the SUS l/O interface shielding metal is mainly used for the shielding of various interfaces and slots.
Depending on strong technical support and comprehensive production capacity, we provide various printed label products and precision die-cuts quickly (within 1-3 days). * Material Options: Tapes, Insulating PC/PP/PET, Foam, Rubber, Aluminium, Copper foil and thermal/Electrical condutive materials; * Manufacturing capabilities: Digital printing, Screen printing, Thermal Forming, Precision Die-cutting, Stamping & Punching, CNC routing, Lamination & Slitting and assembly service. * Color Management: X-rite 7600 chromatometer.
GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.
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