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The development trend of electronic equipment is that more and more powerful devices or modules need to be installed in a smaller and smaller space. In this way, it is more and more important to eliminate the heat that causes the surrounding temperature of the device to rise. Thermal interface materials are used at the junction or interface of heating devices and cooling devices to improve heat transfer.

The thermal interface material is designed from the perspective of material science and engineering, so that the material matches the irregular contact surface and eliminates air gaps, thereby improving the overall heat transfer capability and enabling the device to operate at a safe operating temperature.

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