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TFP2255-00
Dingtalk_20211208171503
Dingtalk_20211208171503
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TFP2255-00

GBT-ViaTHERM TFP2255-00 is a thermally conductive silicone gel pad with a good combination of high thermal conductivity and compressibility. This soft gel pad provides reduced interfacial thermal resistance, along with shock absorption and ease of use. The unique silicone and filler combination has extremely low silicone extractables compared to many other silicone interface products. It is ideal for the purpose of fill gaps between high-power, heat-generating components and related heat sinks, boards or chassis.
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TFP: Thermal pad
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Product Description
Parameters

Key Properties

  • Thermal conductivity 2.2 W/m·K
  • Low deformation force, more effective protection of electrical components with 
  • their own adhesion, generally no additional adhesive 
  • V-0 flame retardant grade 
  • thickness range 0.003” (0.07mm)-0.400” (10.0 mm)

 

Applications

  • desktop, portable computer and server 
  • LED lighting equipment 
  • automotive electronic equipment 
  • LCD and PDP flat panel display 
  • automotive electronic products, battery heat dissipation
     

Product characteristics 

 

 

Characteristic Unit Testing Method TFP2255-00
Colour - Visual Inspection Dark Grey
Thickness mm ASTM D374 0.15~10.0
Thermal Conductivity W/m·K Hot Disk 2.2
ASTM D5470 2.2
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.75
°C·cm²/W 4.85
Hardness Shore OO ASTM D2240 25-55
Flame Retardant  - UL 94V-0
Withstand Voltage Strength (@1MM) kV ASTM D149 >9.0
Volume Resistivity Ω·cm ASTM D257 ≥3.0X10 13
Density g/cm³ ASTM D792 2.60
Tensile Strength psi ASTM D412 36
Elongation % ASTM D412 -
Compression set
(%, specified pressure)		 10psi ASTM D575 10
50psi 42
100psi 58
Dielectric Constant @1MHz ASTM D150 7.5
TML(CVCM) % ASTM E595 ≤0.32(0.08)
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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