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SFG3000
Dingtalk_20211208192826
Dingtalk_20211208192826
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SFG3000

GBT-ViaTHERM SFG3000 is a specially designed one part thermal gel that suitable for high performance devices requiring minimal thermal resistance, maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.
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SFG: Single Part Filler Gel
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Product Description
Parameters
Product Features 
  • Thermal conductivity 3.0 W/m·K
  • The perfect combination of extremely low stress and low thermal resistance
  • High weather resistance and reliability
  • Fully cured
  • Easy to dispense, good plasticity, very good  replacement of thermal conductive silicone grease
 
Applications 
  • Automotive Electronic Control Unit (ECU)
  • Power and semiconductor
  • Memory and power modules
  • Microprocessor/graphics processor
  • Flat panel displays and consumer electronics
 
Standard Packing
  • 30cc, 55cc, 300cc tube 
  • 1kg, 10kg drum

Part Selection Guide

 

Thermal Resistance vs. Pressure

Characteristic

Unit

Testing Method

SFG3000
Colour - Visual inspection Light Yellow
Flow Rate g/min GoodBon 26
Thermal Conductivity W/m·K Hot Disk 3.0
ASTM D5470 3.0
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.08
°C·cm²/W 0.52
Minimum Operation Thickness mm GoodBon 0.08
Flame Retardant Properties - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 13
Density g/cm³ ASTM D792 3.00
Dielectric Constant @1MHz ASTM D150 6.8
Outgassing TML (CVCM) % ASTM E595 ≤0.20(0.08)
Low-molecular-weight Cyclosiloxane (D4-D20) ppm Gas Chromatograph <80
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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