Product Selection Guide
Thermal Resistance vs. Pressure
|Thermal Conductivity||W/m·K||Hot Disk||3.5|
|Minimum Operation Thickness||mm||GoodBon||0.08|
|Flame Retardant Rate||-||UL||94V-0|
|Volume Resistivity||Ω·cm||ASTM D257||≥1.0X1013|
|Dielectric Constant||@1MHz||ASTM D150||6.5|
|Outgassing TML (CVCM)||%||ASTM E595||≤0.15(0.05)|
|Low-molecular-weight Cyclosiloxane (D4-D20)||ppm||Gas Chromatograph||<50|
Depending on strong technical support and comprehensive production capacity, we provide various printed label products and precision die-cuts quickly (within 1-3 days). * Material Options: Tapes, Insulating PC/PP/PET, Foam, Rubber, Aluminium, Copper foil and thermal/Electrical condutive materials; * Manufacturing capabilities: Digital printing, Screen printing, Thermal Forming, Precision Die-cutting, Stamping & Punching, CNC routing, Lamination & Slitting and assembly service. * Color Management: X-rite 7600 chromatometer.
GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.
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