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NFG3500
Dingtalk_20211208202002
Dingtalk_20211208202002
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NFG3500

NFG3500 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and eliminate silicone contamination. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform over irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances.

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SFG: Single Part Filler Gel
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Product Description
Parameters
Product Features 
  • Thermal conductivity 3.5 W/m·K
  • The perfect combination of extremely low stress and low thermal resistance
  • High weather resistance and reliability
  • Fully cured, never dry
  • Easy to dispense, good plasticity, can replace thermal conductive silicone grease
 
Applications 
  • Automotive Electronic Control Unit (ECU)
  • Power and semiconductor
  • Memory and power modules
  • Microprocessor/graphics processor
  • Flat panel displays and consumer electronics
 
Standard Packing
  • 30cc, 55cc, 300cc tube 
  • 1kg, 10kg drum

Product Selection Guide

 

Thermal Resistance vs. Pressure

 
Characteristic Unit Testing Method NFG3500
Colour - Visual inspection White
Flow Rate g/min GoodBon 12
Thermal Conductivity W/m·K Hot Disk 3.5
ASTM D5470 3.5
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.07
°C·cm²/W 0.45
Minimum Operation Thickness mm GoodBon 0.06
Flame Retardant Properties - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 13
Density g/cm³ ASTM D792 3.05
Dielectric Constant @1MHz ASTM D150 6.5
Outgassing TML (CVCM) % ASTM E595 ≤0.15(0.05)
Low-molecular-weight Cyclosiloxane (D4-D20) ppm Gas Chromatograph 225
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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