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Dingtalk_20211208202206
Dingtalk_20211208202206
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SFG6000

GBT-ViaTHERM SFG6000 is a specially designed for the purpose of using in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. In addition to providing application flexibility and variable gap adaptation, SFG6000 will exert minimum stress on the component while maintaining interface contact to maximize thermal transfer. It requires no cure cycle and its cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.
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Product Description
Parameters
Product Features 
  • Thermal conductivity 6.0 W/m·K
  • The perfect combination of extremely low stress and low thermal resistance
  • High weather resistance and reliability
  • Fully cured, never dry
  • Easy to dispense, good plasticity, can replace thermal conductive silicone grease
 
Applications 
  • Automotive Electronic Control Unit (ECU)
  • Power and semiconductor
  • Memory and power modules
  • Microprocessor/graphics processor
  • Flat panel displays and consumer electronics
 
Standard Packing
  • 30cc, 55cc, 300cc tube 
  • 1kg, 10kg drum

Product Selection Guide

 

Thermal Resistance vs. Pressure

Characteristic Unit Testing Method SFG6000
Colour - Visual Inspection Grey
Flow Rate g/min GoodBon 15
Thermal Conductivity W/m·K Hot Disk 6.0
ASTM D5470 6.0
Thermal Resistance
(@1mm,20psi)
°C·in²/W ASTM D5470 0.04
°C·cm²/W 0.26
Minimum Operation Thickness mm GoodBon 0.08
Flame Retardant Properties - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 9
Density g/cm³ ASTM D792 3.25
Dielectric Constant @1MHz ASTM D150 13.5
Outgassing TML (CVCM) % ASTM E595 ≤0.12(0.01)
Low-molecular-weight Cyclosiloxane (D4-D20) ppm Gas Chromatograph <20
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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