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SFG8000
微信截图_20211227161800
截屏2021-12-26 下午9.59.34
微信截图_20211227161800
截屏2021-12-26 下午9.59.34
名称

SFG8000

GBT-ViaTHERM SFG8000 is a specially designed for the purpose of using in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.
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SFG: Single Part Filler Gel
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Product Description
Parameters
Product Features 
  • Thermal conductivity 8.0 W/m·K
  • The perfect combination of extremely low stress and low thermal resistance
  • High weather resistance and reliability
  • Fully cured, never dry
  • Easy to dispense, good plasticity, can replace thermal conductive silicone grease
 
Applications 
  • Automotive Electronic Control Unit (ECU)
  • Power and semiconductor
  • Memory and power modules
  • Microprocessor/graphics processor
  • Flat panel displays and consumer electronics
 
Standard Packing
  • 30cc, 55cc, 300cc tube 
  • 1kg, 10kg drum

Product Selection Guide

 

Thermal Resistance vs. Pressure
Characteristic Unit Testing Method SFG8000
Colour - Visual Inspection Grey
Flow Rate g/min GoodBon 20
Thermal Conductivity W/m·K Hot Disk 8.0
ASTM D5470 8.0
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.022
°C·cm²/W 0.142
Minimum Operation Thickness mm GoodBon 0.08
Flame Retardant Properties - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 9
Density g/cm³ ASTM D792 3.25
Dielectric Constant @1MHz ASTM D150 12.5
Outgassing TML (CVCM) % ASTM E595 ≤0.12(0.01)
Low-molecular-weight Cyclosiloxane (D4-D20) ppm Gas Chromatograph <20
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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