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Thermal Interface Material
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EMI Shielding Materials
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EMI RF ABSORBER
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Heat Dissipation Solutions
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Smart Manufacturing Solutions
GoodBon's FleXEAL™ Form-In-Place (FIP) materials open a new chapter for gasket market. These materials (electrically conductive or non-conductive) offer mechanicle and electrical engineers design flexbility. Automated process increases the productivity and precision, meanwhile reduces the lead time and operation cost. Goodbon Technology has the capability of developing materials and processing the assembly. We are you one-stop solution for FIP technology.
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Contact
Asia: sales-asia@goodbontech.com
North America: sales-na@goodbontech.com
EMEA: sales-emea@goodbontech.com
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