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TFG2055
Dingtalk_20211208192733
Dingtalk_20211208192733
名称

TFG2055

GBT-ViaTHERM TFG2055 is a two-component thermally conductive liquid gap filling material, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, and easy to dispense. The physical appearance is a soft, form-in-place elastomer. TFG2055 is ideal for combining fragile components with high topography and / or stack-up tolerances to general heat sink or housing. After curing, the product won't pump from the interface as a result of thermal cycling and is dry to the touch.
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TFG: Two-part Filler Gel
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Product Description
Parameters
Product Features 
  • Thermal conductivity 2.0 W/m·K
  • Various types of thermal conductivity are available for selection and customization
  • Good liquidity, easy to operate
  • Suitable for room temperature and heating curing
  • Good electrical insulation, temperature and weather resistance
  • RoHS compatible
 
Applications 
  • Consumer electronics, communication equipment
  • Printed circuit board assembly, housing connection
  • Automotive electronics
  • Military electronic equipment
 
Standard Packing 
  • 50cc, 400cc syringes
  • 40kg group: A component 20kg/barrel, B component 20kg/barrel
  • Customer-specific combination
 
Storage Condition
  • This product is non-toxic and non-dangerous. It is handled and transported as general chemicals and stored in a cool (room temperature) dry place. The shelf life is 6 months.
 
Operation Steps 
  • 1. Dispensing: the syringe and the mixing needle can be used to dispense the glue at the required position by using the glue dispenser or the glue gun; the barrel combination is according to the ratio of 1:1, and the component B is added to the component A and mixed evenly, and then Used in the design position by dispensing/painting/printing and other assembly methods;
  • 2. Curing: After the components are equipped, they are cured at room temperature or by heating. If the curing time is too long in winter, it is recommended to use heating curing method.

Characteristic Unit TFG1800
- - A component B Component 
Colour - Yellow White
The Mixing Ratio - 1:1
Viscosity cps 250000
Viscosity After Mixing cps 250000
Minimum Operating Thickness mm 0.05
Operating time@25°C min 60
Curing time (90%) min(@100℃) 10
h(@25℃) 5
    After curing
Hardness Shore OO 55
Thermal Conductivity  W/m·K 2.0
Thermal Resistance @50psi °C·in²/W ≤0.08
Dielectric Strength (@1MM) kV ≥10
Volume Resistivity Ω·cm ≥1.0X1013
Density g/cm³ 2.6
Dielectric constant @1MHz 6.5
Small molecule cyclosiloxane (D4-D20) ppm ≤100
CTE (Coefficient of Thermal Expansion) ppm/°C -
Flame Retardant Properties UL. 94 V-0
Operation Temperature °C -60~+200
RoHS  - YES
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