|-||-||A component||B Component|
|The Mixing Ratio||-||1:1|
|Viscosity After Mixing||cps||500,000|
|Minimum Operating Thickness||mm||0.1|
|Curing Time (90%)||min(@100℃)||20|
|Thermal Resistance @50psi||°C·in²/W||≤0.035|
|Dielectric Strength (@1MM)||kV||≥9|
|Small molecule cyclosiloxane (D4-D20)||ppm||≤30|
|CTE (Coefficient of Thermal Expansion)||ppm/°C||135|
|Flame Retardant Properties||UL. 94||V-0|
Depending on strong technical support and comprehensive production capacity, we provide various printed label products and precision die-cuts quickly (within 1-3 days). * Material Options: Tapes, Insulating PC/PP/PET, Foam, Rubber, Aluminium, Copper foil and thermal/Electrical condutive materials; * Manufacturing capabilities: Digital printing, Screen printing, Thermal Forming, Precision Die-cutting, Stamping & Punching, CNC routing, Lamination & Slitting and assembly service. * Color Management: X-rite 7600 chromatometer.
GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.
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