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TPC: Thermal Potting Compound

ViaTHERM™ TPC（Thermally conductive potting compound) material, is good for potting and encapsulating of fragile components inside an electronic enclosure, to improve the heat conducting and enhance the relibility of the whole product. 

ViaTHERM™ TPC1502/03

ViaTHERM™ TPC 1500/03 series is a two part thermally conductive potting encapsulte material. It has both moisure and thermal curing versions. The mix ratio between A and B are 1:1 (upon weight). 

ViaTHERM™ TPC1502/03
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