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TFPX255-00
Dingtalk_20211209153515
Dingtalk_20211209153515
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TFPX255-00

GBT-ViaTHERM TFPX255-00 is a 12.0 W/m∙K thermal pad with both excellent thermal conductivity and softness/compressiveness. The material balances good between high K and its softness so that provide for ideal elasticity and conformability. 

 

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TFP: Thermal pad
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Product Description
Parameters

Key Properties

  • Thermal conductivity 12.0 W/m·K
  • Thickness range 0.015” (0.30mm)-0.400” (10.0 mm)
  • Low-volatile, low molecular silicone content
  • Naturally Tacky & Reworkable

 

Applications

  • Automotive Electronics
  • Power Supplies
  • IC package 

Product Number Definition Rules

 

Thermal Resistance vs. Thickness, Pressure
Characteristic Unit Testing Method TFPX255-00
Colour - Visual Inspection Grey
Thickness mm ASTM D374 0.30~10.0
Thermal Conductivity W/m·K Hot Disk 12.0
ASTM D5470 12.0
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.22
°C·cm²/W 1.41
Hardness Shore OO ASTM D2240 55
Flame Retardant  - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 09
Density g/cm³ ASTM D792 3.17
Tensile Strength psi ASTM D412 30
Elongation % ASTM D412 25
Compression set
(%, specified pressure)		 10psi ASTM D575 8
50psi 23
100psi 39
Dielectric Constant @1MHz ASTM D150 16.0
TML(CVCM) % ASTM E595 ≤0.12(0.05)
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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