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截屏2021-12-20 下午9.39.44
截屏2021-12-20 下午9.39.44
名称

TFP8050-00

GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.
GBT-ViaTHERM TFP8050-00 is a 8 W/m∙K thermal pad with superb thermal performance and high compressibility. This product series also encludes normal and ultra-soft version. The material has inherent tackiness on both sides allows the product to effectively fill irregular air gaps so that to imporve the overall thermal performance.
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Product Description
Parameters
Product characteristics 
  • Thermal conductivity 8.0 W/m·K
  • Thickness range 0.015” (0.30mm)-0.400” (10.0 mm)
  • High Thermal Performance with competative cost level
  • Naturally Tacky & Reworkable
  • Soft
 
Applications 
  • ECU
  • Power Supplies & Semiconductor
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Consumer Electronics

Product Number Definition Rules

 

Thermal Resistance vs. Thickness, Pressure

Characteristic Unit Testing Method TFP8050-00
Colour - Visual Inspection Grey
Thickness mm ASTM D374 0.30~10.0
Thermal Conductivity W/m·K Hot Disk 8.0
ASTM D5470 8.0
Thermal Resistance
(@1mm,20psi)
°C·in²/W ASTM D5470 0.25
°C·cm²/W 1.61
Hardness Shore OO ASTM D2240 50
Flame Retardant  - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 11
Density g/cm³ ASTM D792 3.07
Tensile Strength psi ASTM D412 40
Elongation % ASTM D412 45
Compression set
(%, specified pressure)
10psi ASTM D575 8
50psi 26
100psi 42
Dielectric Constant @1MHz ASTM D150 13.5
TML(CVCM) % ASTM E595 ≤0.15(0.05)
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES

Download

SFG8000 TDS en.pdf

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2021-12-14 19:15:31

GBT-ViaTHERM TFP8005-00-02.pdf

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2021-12-14 19:15:17
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