TFP6050-00
GBT-ViaTHERM TFP6050-00 is a 6.0 W/m∙K soft thermal interface gap filler with great thermal performance and high compliancy. The material yields extremely soft characteristics while maintaining elasticity and conformability. The Inherent natural tackiness on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. It is ideally for the purpose of filling gaps between high-power, heat-generating components and related heat sinks, boards or chassis.
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TFP: Thermal pad
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