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TFP6050-00
Dingtalk_20211209153515
Dingtalk_20211209153515
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TFP6050-00

GBT-ViaTHERM TFP6050-00 is a 6.0 W/m∙K soft thermal interface gap filler with great thermal performance and high compliancy. The material yields extremely soft characteristics while maintaining elasticity and conformability. The Inherent natural tackiness on both sides assists in application and allows the product to effectively fill air gaps, enhancing the overall thermal performance. It is ideally for the purpose of filling gaps between high-power, heat-generating components and related heat sinks, boards or chassis.
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TFP: Thermal pad
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Product Description
Parameters

Key Properties

  • Thermal conductivity 6.0 W/m·K
  • Thickness range 0.015” (0.30mm)-0.400” (10.0 mm) 
  • High Thermal Performance with competative cost level
  • Naturally Tacky & Reworkable
  • Soft

 

Applications 

  • ECU
  • Power Supplies & Semiconductor
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Consumer Electronics

Product Number Definition Rules

 

Thermal Resistance vs. Thickness, Pressure
Characteristic Unit Testing Method TFP6050-00
Colour - Visual Inspection Grey
Thickness mm ASTM D374 0.30~10.0
Thermal Conductivity W/m·K Hot Disk 6.0
ASTM D5470 6.0
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.26
°C·cm²/W 1.68
Hardness Shore OO ASTM D2240 55
Flame Retardant  - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 12
Density g/cm³ ASTM D792 3.10
Tensile Strength psi ASTM D412 52
Elongation % ASTM D412 50
Compression set
(%, specified pressure)		 10psi ASTM D575 11
50psi 30
100psi 48
Dielectric Constant @1MHz ASTM D150 14.0
TML(CVCM) % ASTM E595 ≤0.15(0.04)
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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