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TFP3550-00
截屏2021-12-23 上午7.21.45
截屏2021-12-23 上午7.21.45
名称

TFP3550-00

GBT-ViaTHERM TFP3550-00 is a thermally conductive silicone gel pad with a good combination of high thermal conductivity, compressibility and dielectric strength. Reinforced with a polyimide-liner, the material has good resistant to shear and mechanical forces, recommended for applications that require a minimum amount of pressure on components. TFP3550-00 is an ideal material to be used in applications that requiring excellent thermal performance and isolation between heat sink and high-voltage devices.
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TFP: Thermal pad
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Product Description
Parameters

Key Properties

  • Thermal conductivity 3.5 W/m·K
  • Thickness range 0.010” (0.25mm)-0.400” (10.0 mm)
  • High Thermal Performance with competative cost level
  • Naturally Tacky & Reworkable
  • Soft
 
Applications 
  • ECU
  • Power Supplies & Semiconductor
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Consumer Electronics

Product Number Definition Rules

 

Thermal Resistance vs. Thickness, Pressure
Characteristic Unit Testing Method TFP3550-00
Colour - Visual Inspection Pink
Thickness mm ASTM D374 0.25~10.0
Thermal Conductivity W/m·K Hot Disk 3.5
ASTM D5470 3.5
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.35
°C·cm²/W 2.26
Hardness Shore OO ASTM D2240 25
Flame Retardant  - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 13
Density g/cm³ ASTM D792 3.10
Tensile Strength psi ASTM D412 26
Elongation % ASTM D412 45
Compression set
(%, specified pressure)		 10psi ASTM D575 16
50psi 48
100psi 62
Dielectric Constant @1MHz ASTM D150 12.0
TML(CVCM) % ASTM E595 ≤0.20(0.05)
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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