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TFP3050-00
截屏2021-12-17 上午8.09.28
Dingtalk_20211208172200
截屏2021-12-17 上午8.09.28
Dingtalk_20211208172200
名称

TFP3050-00

GBT-ViaTHERM TFP3050-00 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m·K, the material offers exceptional thermal performance at low pressures, and it can easily fit in and adhere to most shapes and sizes of components, and makes reliable and complete physical contact. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. TFP3050-00 is an ideal product for high-performance applications at low mounting pressure.
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TFP: Thermal pad
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Product Description
Parameters

Key Properties

  • Thermal conductivity 3.0 W/m·K
  • Thickness range 0.008” (0.2mm)-0.400” (10.0 mm)
  • High Thermal Performance with competative cost level
  • Naturally Tacky & Reworkable
 
Applications 
  • ECU
  • Power Supplies & Semiconductor
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Consumer Electronics

Product Number Definition Rules

 

Thermal Resistance vs. Thickness, Pressure
Characteristic Unit Testing Method TFP3050-00
Colour - Visual Inspection Grey
Thickness mm ASTM D374 0.20~10.0
Thermal Conductivity W/m·K Hot Disk 3.0
ASTM D5470 3.0
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.42
°C·cm²/W 2.71
Hardness Shore OO ASTM D2240 50
Flame Retardant  - UL 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 13
Density g/cm³ ASTM D792 3.00
Tensile Strength psi ASTM D412 52
Elongation % ASTM D412 57
Compression set
(%, specified pressure)		 10psi ASTM D575 12
50psi 42
100psi 56
Dielectric Constant @1MHz ASTM D150 13.5
TML(CVCM) % ASTM E595 ≤0.18(0.05)
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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