NFP: Non-silicon Thermal Pad_Product Center

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Thermal Interface Material 
EMI Shielding Materials 
EMI RF ABSORBER 
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- Heat Sink Assembly
- Heat Pipe
Smart Manufacturing Solutions 
- Scalable Automation Solutions
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Thermal Interface Material

NFP: Non-silicon Thermal Pad

GoodBon Tech's NFP(Non-silicone thermal pads), it is a thermally conductive, electrically insulating gap pad specially designed for silicones sensitive environments, such as automotive electronics, Avionics, consumer electronics, etc.

Contact

Asia: sales-asia@goodbontech.com
North America: sales-na@goodbontech.com
EMEA: sales-emea@goodbontech.com

Thermal Interface Material 

TFP: Thermal pad

NFP: Non-silicon Thermal Pad

SFG: Single Part Filler Gel

TFG: Two-part Filler Gel

TGR: Thermal Grease

PCF: Phase Change Film

EB: Electrical Blocker/Insulator

TPC: Thermal Potting Compound

EMI Shielding Materials 

EC: Electrically Conductive Seal

NC: Non-Conductive Seal

EF: Electrically Conductive FIP

eFleXM™: EMI Foam Gasket and Tape 

eFLEXFOAM: conductive tape and conductive foam

eFLESULATE: Insulation Material

eVENTI™: Ventilation panel/Air Filters

eMETAL™: EMI STAMPING METAL 

SP: Specialized Shielding Parts

CN: Shielding Can

FS: Finger Stock

SC: Spring Contact

EMI RF ABSORBER 

FW: Foam Absorber

SW: Silicone Absorber

MW: Moldable Absorber

DW: Dispensable Absorber

HW: EMI/Thermal Hybrid Absorber

TW: Thin Magnetic Absorber

WA: Woven Fabric Absorber

Heat Dissipation Solutions 

Heat Sink Assembly

Heat Pipe

Smart Manufacturing Solutions 

Scalable Automation Solutions

Die-cutting&Label Printing