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TFP2850-00
截屏2021-12-20 上午7.27.52
截屏2021-12-20 上午7.27.52
名称

TFP2850-00

GBT-ViaTHERM TFP2850-00 is a compliant elastomeric thermal interface material designed to provide excellent thermal performance at competitive cost. Its soft interface pad conforms well to minimal pressure, resulting in little or no stress on mating parts. It has extremely low silicone extractables compared to many other silicone interface products and also meets NASA outgassing specification.
TFP2850-00 is naturally tacky, and no adhesive coating is required. It is electrically insulating material, the operational temperature between-60ºC to 200ºC and is certified as UL-94 V0 in flammability rating.
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TFP: Thermal pad
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Product Description
Parameters

Key Properties

  • Thermal conductivity 2.8 W/m·K
  • Thickness range 0.008” (0.2mm)-0.400” (10.0 mm)
  • High Thermal Performance with competative cost level
  • Naturally Tacky & Reworkable
 
Applications
  • ECU
  • Power Supplies & Semiconductor
  • Memory & Power Modules 
  • Microprocessors / Graphics Processors/Consumer Electronics

Product Number Definition Rules

 

Thermal Resistance vs. Thickness, Pressure
Characteristic Unit Testing Method TFP2850-00
Colour - Visual Inspection Light Blue
Thickness mm ASTM D374 0.20~10.0
Thermal Conductivity W/m·K Hot Disk 2.8
ASTM D5470 2.8
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.46
°C·cm²/W 2.97
Hardness Shore OO ASTM D2240 20-50
Flame Retardant  - UL 94V-0
Withstand Voltage Strength (@1MM) kV ASTM D149 >9.0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X1013
Density g/cm³ ASTM D792 3.00
Tensile Strength psi ASTM D412 60
Elongation % ASTM D412 -
Compression set
(%, specified pressure)		 10psi ASTM D575 12
50psi 35
100psi 48
Dielectric Constant @1MHz ASTM D150 12.5
TML(CVCM) % ASTM E595 ≤0.20(0.05)
Operation Temperature °C GoodBon -60~200
RoHS  - GoodBon YES
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