TFG: Two-part Filler Gel_Product Center

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Thermal Interface Material

TFG: Two-part Filler Gel

ViaTHERM™ TFG(two-part thermal gel) contains A and B part, it is a cured-in-place material. Generally, the glue is applied on the customer site at a mixing ratio of 1:1. The curing method of the gel is divided into thermal curing and room temperature moisture curing. The physical state after curing is equivalent to the ultra-soft version of the thermal pad. Due to the on-site curing process and the application of automatic dispensing equipment, it is more suitable for large-scale mass production application scenarios.
GoodBon Technology provides product selection from 2w/mk to 6w/mk according to thermal conductivity. At the same time, it has a engineering team with rich experience in automation mass production, which can provide customers with one-stop solutions from material design to mass production automation!