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NFP2060-00
Dingtalk_20211208171750
Dingtalk_20211208171750
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NFP2060-00

GBT-ViaTHERM NFP2060-00 is a high-performance, compliant, silicone-free thermal interface material. By coupling extremely high thermal conductivity (2.0W/m·K) with exceptional wetting characteristics, NFP2060-00 provides low thermal resistance between heat source component and heat dissipation part or housing. This makes it well-suited for applications in which silicone-based pads are traditionally used as well as those silicone-sensitive applications. NFP2060-00 is naturally tacky on both sides requiring no additional adhesive coating. The natural tack allows the pad to be held in place during assembly.
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NFP: Non-silicon Thermal Pad
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Product Description
Parameters

Key Properties​​​​​​​

  • Thermal conductivity of 2.0 W / m · K
  • Non-silicon substrate, the silicon-sensitive applications where the
  • Excellent dielectric properties and thermal conductivity properties of
  • V-0 flame rating
  • Thickness ranging from 0.010 "(0.25mm) to 0.400" (10.0mm)
 
Applications 
  • Silicon-free environment, silicon-sensitive areas
  • Aerospace
  • Optical communication
  • Optical signal equipment
  • Projection equipment
  • Light control equipment

Product characteristics 

 

 

Characteristic Unit Testing Method NFP2060-00
Colour - Visual Inspection White
Thickness mm ASTM D374 0.25~10.0
Thermal Conductivity W/m·K Hot Disk 2.00
ASTM D5470 2.00
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.70
°C·cm²/W 4.52
Hardness Shore OO ASTM D2240 60
Flame Retardant Properties - UL 94 V-0
Withstand Voltage Strength (@1MM) kV ASTM D149 >9.0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X10 14
Density g/cm³ ASTM D792 2.40
Tensile Strength psi ASTM D412 36
Elongation % ASTM D412 55
Compression set
(%, specified pressure)		 10psi ASTM D575 8
50psi 20
100psi 35
Dielectric Constant @1MHz ASTM D150 6.5
Operation Temperature °C GoodBon -40~110
RoHS  - GoodBon YES
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