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NFP4055-00
Dingtalk_20211208172736
Dingtalk_20211208172736
名称

NFP4055-00

GBT-ViaTHERM NFP4055-00 is a high-performance, compliant, silicone-free thermal interface material. By coupling extremely high thermal conductivity (4.0W/m·K) with exceptional wetting characteristics, NFP4055-00 provides low thermal resistance between heat source component and heat dissipation part or housing. This makes it well-suited for applications where silicone-based pads are traditionally used as well as those applications which are silicone-sensitive, especially in optical industry. NFP4055-00 is naturally tacky on both sides requiring no additional adhesive coating. The natural tack allows the pad to be held in place during assembly.
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NFP: Non-silicon Thermal Pad
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Product Description
Parameters
Key Properties
  • Thermal conductivity of 4.0 W / m · K
  • Non-silicon substrate, the silicon-sensitive applications where the
  • Excellent dielectric properties and thermal conductivity properties of
  • V-0 flame rating
  • Thickness ranging from 0.012 "(0.30mm) to 0.400" (10.0mm)
 
Applications 
  • Silicon environment, silicon sensitive areas
  • Aerospace
  • Optical communication
  • Optical signal equipment
  • Projection equipment
  • Light control equipment
  • Advanced Industrial Control
  • Medical electronics

Product characteristics 

 

 

Characteristic Unit Testing Method NFP4055-00
Colour - Visual Inspection Violet
Thickness mm ASTM D374 0.30~10.0
Thermal Conductivity W/m·K Hot Disk 4.00
ASTM D5470 4.00
Thermal Resistance
(@1mm,20psi)		 °C·in²/W ASTM D5470 0.42
°C·cm²/W 2.71
Hardness Shore OO ASTM D2240 55
Flame Retardant Properties - UL 94 V-0
Withstand Voltage Strength (@1MM) kV ASTM D149 >9.0
Volume Resistivity Ω·cm ASTM D257 ≥5.0X10 13
Density g/cm³ ASTM D792 1.60
Tensile Strength psi ASTM D412 32
Elongation % ASTM D412 50
Compression set
(%, specified pressure)		 10psi ASTM D575 12
50psi 35
100psi 62
Dielectric Constant @1MHz ASTM D150 3.5
Operation Temperature °C GoodBon -40~110
RoHS  - GoodBon YES
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