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Thermal Interface Material

SFG: Single Part Filler Gel

SFGX000

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SFGX000

GBT-ViaTHERM SFGX000 is a specially designed for the purpose of using in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. In addition to providing application flexibility and variable gap adaptation, SFGX000 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer. It requires no cure cycle and it’s cross-linked gel structure provides superior long term thermal stability and reliable performance over conventional greases.

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SFG: Single Part Filler Gel

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Product Description

Parameters

Characteristic	Unit	Testing Method	SFGX000
Colour	-	Visual Inspection	Light Gray
Flow Rate	g/min	30cc Syringe & 0.1" Nozzle @90psi	15
Thermal Conductivity	W/m·K	Hot disk	10
Thermal Conductivity	W/m·K	ASTM D5470	12
Thermal Resistance @ 20 psi	°C·in ² /W	ASTM D5470	0.019
Thermal Resistance @ 20 psi	°C·cm ² /W	ASTM D5470	0.122
Flame Retardant Properties	-	UL	94 V-0
Volume Resistivity	Ω·cm	ASTM D257	≥1.0×10 ⁹
Compressive Strength	kV(@ 1mm)	ASTM D149	>6.0
Density	g/cm ³	ASTM D792	3.35
Dielectric Constant	@1 MHz	ASTM D150	10.5
Outgassing TML (CVCM)	%	ASTM E595	≤0.20 (0.01)
Operation Temperature	°C	GoodBon	-60 to 150
RoHS	-	GoodBon	Yes

SFG8000

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